Faster Bootstrapping via Modulus Raising and Composite NTT. IACR Transactions on Cryptographic Hardware and Embedded Systems, [S. l.], v. 2024, n. 1, p. 563–591, 2023. DOI: 10.46586/tches.v2024.i1.563-591. Disponível em: https://metalla.org/index.php/TCHES/article/view/11262.. Acesso em: 16 dec. 2024.